CONNECTION STRUCTURE OF CONDUCTIVE LAYER, CONDUCTIVE WIRE, COIL, AND APPARATUS

Japanese Patent JP2023019936

A

To provide a connection structure of a conductive layer, capable of realizing a low electric resistance.SOLUTION: A connection structure of a conductive layer includes: a first conductive member including a first conductive layer and a first substrate, extending in a first direction, and curved in the first direction so that the side of the first conductive layer becomes a convex; a second conductive member including a second conductive layer and a second substrate, extending in the first direction, and curved in the first direction so that the side of the second conductive layer becomes a convex; a third conductive member having a third conductive layer having a first surface opposite to a convex side of the first conductive layer and a convex side of the second conductive layer and a second surface opposite to the first surface and a third substrate opposite to the second surface, and extending in the first direction; a first connection layer existing between the convex side of the first conductive layer and the third conductive layer, and having a thickness of a first position thinner than that of a second position where a distance from the second conductive layer is far from the first position; and a second connection layer existing between the convex side of the second conductive layer and the third conductive layer, and having a thickness of a third position thinner than that of a fourth position where a distance from the first conductive layer is far from the third position.SELECTED DRAWING: Figure 1

HATTORI YASUSHI
EGUCHI TOMOKO
HAGIWARA MASAYA
ALBESSARD KEIKO

JP2021125021A

February 09, 2023

July 30, 2021

Click for automatic bibliography generation  

TOSHIBA CORP

H01R4/68; H01F6/06

Torushin Ikegami
Akira Sudo
Masahiro Takashita

Previous Patent: Communications processor and communications processing program.

Next Patent: Mail processor and mail processing program