Title:
CONNECTION STRUCTURE OF INDUCTANCE ELEMENT
Document Type and Number:
Japanese Patent JP2019212886
Kind Code:
A
Abstract:
To provide a connection structure of an inductance element that can significantly reduce the length of a wire, reduce material costs, and reduce electromagnetic interference.SOLUTION: A connection structure of an inductance element includes a circuit board having a through hole, an inductance element having at least one wire, a support member fixed to a base, a housing member formed in the support member and providing a housing space, a positioning member housed in the housing space and having a positioning portion, a connection member having a first connection portion and a second connection portion, and a lock member having a lock portion fitted to the second connection portion so as to be locked to the circuit board. The wire has a fixed terminal at one end not connected to the inductance element, and the first connection portion and the positioning portion are fitted so as to sandwich the fixed terminal.SELECTED DRAWING: Figure 4
Inventors:
LI LEI MING
LIN XIN-HUNG
LIN XIN-HUNG
Application Number:
JP2018185143A
Publication Date:
December 12, 2019
Filing Date:
September 28, 2018
Export Citation:
Assignee:
TAIDA ELECTRONIC IND CO LTD
International Classes:
H01F27/29; H01F27/06; H01F27/28; H01F27/30; H01F37/00; H01R12/51
Domestic Patent References:
| JP2013225564A | 2013-10-31 | |||
| JPH1012292A | 1998-01-16 | |||
| JP2018041919A | 2018-03-15 | |||
| JPS59195721U | 1984-12-26 | |||
| JPS55135478U | 1980-09-26 |
Attorney, Agent or Firm:
Ebisu International Patent Office