Title:
接続構造体の製造方法、及び接続構造体の製造装置
Document Type and Number:
Japanese Patent JP5567239
Kind Code:
B1
Abstract:
A cover stripping step of peeling off an insulating cover on a distal end side of an insulated wire to form a wire tip; a marking step of forming a marking on the insulating cover at a predetermined position; a first marking inspection step of inspecting a stripping state and the marking; a wire insertion step of inserting the wire tip into a closed-barrel-type pressure-bonding section; a pressure-bonding step of pressure-bonding the pressure-bonding section to be connected to the wire tip; and a second marking inspection step of inspecting a pressure-bonded state of the pressure-bonding section to the wire tip using the marking are performed in this order, and the first marking inspection step and the second marking inspection step are performed using the same inspection step part.
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Inventors:
Kawamura Kodai
Satoshi Takamura
Go Omotani
Koichi Kitagawa
Aramaki Eiji
Fukunaga Kouki
Satoshi Takamura
Go Omotani
Koichi Kitagawa
Aramaki Eiji
Fukunaga Kouki
Application Number:
JP2014508206A
Publication Date:
August 06, 2014
Filing Date:
December 28, 2013
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
Furukawa as Co., Ltd.
Furukawa as Co., Ltd.
International Classes:
H02G1/14; H01B13/00; H01B13/012; H01R43/048; H02G1/12
Domestic Patent References:
| JP2005327690A | 2005-11-24 | |||
| JP2009272141A | 2009-11-19 | |||
| JPH03245413A | 1991-11-01 | |||
| JPH0888071A | 1996-04-02 |
Attorney, Agent or Firm:
Motoaki Nagata
Eiji Ota
Hiroshi Nishimura
Yoshiaki Nagata
Eiji Ota
Hiroshi Nishimura
Yoshiaki Nagata