Title:
CONNECTION STRUCTURE OF PARTICLE
Document Type and Number:
Japanese Patent JP2007138066
Kind Code:
A
Abstract:
To obtain a connection structure of conductive particle having excellent connection reliability of fine electrode, high insulation properties between adjacent electrodes of narrow space, useful for a connection member for enabling connection having a low connection resistance and long-term reliability in an electric connection of fine pattern wiring.
The connection structure of conductive particles is obtained by connecting a plurality of mutually separately arranged conductive particles with an insulating resin. The connection structure of conductive particles is obtained by using both a crosslinked polymer and a noncrosslinked polymer as the insulating resin.
Inventors:
USUI TAKETOSHI
SHIMADA HITOSHI
SHIMADA HITOSHI
Application Number:
JP2005335695A
Publication Date:
June 07, 2007
Filing Date:
November 21, 2005
Export Citation:
Assignee:
ASAHI KASEI DENSHI KK
International Classes:
C08L101/00; C08K3/08; C08L33/06; H01B5/16; H01R11/01
Domestic Patent References:
| JP2003005504A | 2003-01-08 | |||
| JPH06228442A | 1994-08-16 | |||
| JPH11194493A | 1999-07-21 |
Foreign References:
| WO2005054388A1 | 2005-06-16 |
Attorney, Agent or Firm:
Hideo Takei
Takeshi Shimizu
Joi Ito
Yoshio Narui
Takeshi Shimizu
Joi Ito
Yoshio Narui
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