To provide a connection structure of a printed wiring board, a head stack assembly with the connection structure of the printed wiring board, a magnetic disk drive with the head stack assembly, and a method of manufacturing the connection structure of the printed wiring board such that complication of manufacturing processes and an increase in cost can be prevented, and electric and mechanical connections are improved in reliability.

There is provided a connection structure 1000 of a printed wiring board including a first printed wiring board 321 which has an exposed lead 321b on a base material 321a, a second wiring board 333 which has a conductor 333b for receiving the lead 321b, and an anisotropic conductive material 500 connecting the lead 321b and the conductor 333b to each other. The conductor 333b is exposed in a recessed part U formed by opening a part of an insulating layer 333c laminated on a base material 333a, and the anisotropic conductive material 500 is interposed to fill the recessed part U.