To prevent increase in stresses at the soldered part of a terminal and a printed circuit board.

An alignment plate 15 has a structure such that one rubber plate 17 is stretched within a synthetic resin frame, and a positioning hole 18 is formed in the rubber plate 17 so as to be matched with a connecting hole H of a printed circuit board P, and a terminal 12 is inserted into the holes 18, H. The terminal 12 is soldered M to the lower surface of the connecting hole H. When ambient temperature is raised, displacement is produced between the alignment plate 15 and the printed circuit board P by a difference in coefficient of thermal expansion. When the printed circuit board P is displaced in the arrow direction X, since the rubber plate 17 is softened and deformed easily, the terminal 12 is vertically held according to the deformation of the rubber plate 17, and at the same time, the positioning hole 12 follows the connecting hole H. Thereby, stresses applied to the soldered part M is reduced or eliminated.