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Title:
CONNECTOR MODULE AND ID SETTING METHOD OF CONNECTOR MODULE
Document Type and Number:
Japanese Patent JP2012243188
Kind Code:
A
Abstract:

To provide connector modules each of which the ID can be set by a simple configuration, and an ID setting method of connector modules.

Wire bonds L0 to L3 are provided between respective ID setting terminals ID0 to ID3 and a ground terminal GND. A DC power source 14 is connected between desired ID setting terminals out of the ID setting terminals ID0 to ID3 and the ground terminal GND to cause a current to flow to object wire bonds, whereby the wire bonds are cut by heat generation. An ID of a connector module 11 can be set by the combination of cut wire bonds. Consequently, the ID can be set by the very simple method, and problems such as installation error can be avoided because the ID can be set after installation of the connector module 11 in a prescribed position.


Inventors:
SATAKE SHUJI
KANAZAWA AKIYOSHI
ITO TAKESHI
MAEJIMA YOSHIMITSU
TSUBAKI KAZUYA
KUBOTA KAZUHIRO
Application Number:
JP2011114473A
Publication Date:
December 10, 2012
Filing Date:
May 23, 2011
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
G06F13/14; G06F3/00
Domestic Patent References:
JP2002141468A2002-05-17
JPH08110882A1996-04-30
JPH09139256A1997-05-27
JP2008186213A2008-08-14
JP2000068458A2000-03-03
JPH09199671A1997-07-31
JP2012146178A2012-08-02
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu



 
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