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Patent Searching and Data


Title:
CONNECTOR MOUNTING METHOD
Document Type and Number:
Japanese Patent JPH01176681
Kind Code:
A
Abstract:

PURPOSE: To prevent outflow of fused ring solder so as to improve reliability at mounting of a connector by inserting a washer made of material excellent in soldering property further after the ring solder set round a connector pin projected from the plate face of a printed board.

CONSTITUTION: A metal excellent in soldering property, for example, a washer 5 plated with gold, etc., is set after a ring solder 11 set round a connector pin 1. That is, the washer 5 is finished into such dimensions that it may be set, in the press fit condition, round the connector pin 1, and the ring solder 11 is soldered in the form that it is pressed toward a printed board 20 side by the washer 5 set after. By arranging the washer 5 excellent in soldering property at the rear of the ring solder 11 like this, the fused ring solder which was going to flow toward the tip of the connector pin 1 all adheres to the washer 5. Hereby, solder rising phenomena can be exactly prevented.


Inventors:
BABA TAKASHI
Application Number:
JP97288A
Publication Date:
July 13, 1989
Filing Date:
January 05, 1988
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01R43/02; H05K3/34; (IPC1-7): H01R43/02; H05K3/34
Domestic Patent References:
JPS59223629A1984-12-15
JPS6128728U1986-02-20
JPS4888649A1973-11-20
JPS5058761A1975-05-21
JPS4926965A1974-03-09
Attorney, Agent or Firm:
Sadaichi Igita