Title:
コネクタ実装構造
Document Type and Number:
Japanese Patent JP4776483
Kind Code:
B2
Abstract:
In a connector mounting structure, a printed-wiring board has a cut portion, a modular connector connecting pattern provided adjacent to the cut portion, and a connecting pattern provided isolated from the modular connector connecting pattern and connecting an SFP connector. Also, the printed-wiring board and a front board are combined in order that the cut portion faces a plane of an opening which the front board has. When a modular connector is inserted into the opening, the modular connector is supported by the opening and the cut portion and concurrently the modular connector is electrically contacted with the modular connector connecting pattern. When an SFP front cage is inserted into the opening, the SFP front cage is supported by the opening and the cut portion and concurrently an SFP module becomes connectable to the SFP connector through the SFP front cage.
Inventors:
Kiyonori Kusunoda
Hisato Sato
Hisato Sato
Application Number:
JP2006254428A
Publication Date:
September 21, 2011
Filing Date:
September 20, 2006
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01R12/71; H01R12/72; H01R24/62
Domestic Patent References:
| JP5037115A | ||||
| JP2000517098A | ||||
| JP2005520296A | ||||
| JP8180915A | ||||
| JP2004247259A | ||||
| JP5159825A |
Attorney, Agent or Firm:
Shuji Moizumi