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Patent Searching and Data


Title:
CONNECTOR WITH GROUNDING PLATE
Document Type and Number:
Japanese Patent JP2007220427
Kind Code:
A
Abstract:

To provide a connector with a grounding plate that is suitable for transmission and reception of high-frequency/high-speed signals and enables adjustment of its characteristic impedance.

The connector with a grounding plate has a signal terminal 13x made of a conductive metal, a grounding terminal 13y made of a conductive metal, and the grounding plate 13z connected to the grounding terminal 13y that are provided inside a housing 12 made of a nonconductive resin. The grounding plate 13z is formed by stacking a space plate 13z2 by insert molding on both of the front and rear surfaces of a base 13z1 formed from a conductive metal into a shape of a plate, using as the material a nonconductive resin having a permittivity different from that of the nonconductive resin used for the housing 12. The grounding plate 13z is fitted to the inside of the housing 12 that is separately formed by molding. Adjustment of the characteristic impedance is made possible by appropriately selecting the resin for the grounding plate 13z.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
TERUKI SATORU
Application Number:
JP2006038287A
Publication Date:
August 30, 2007
Filing Date:
February 15, 2006
Export Citation:
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Assignee:
TAIKO DENKI CO LTD
International Classes:
H01R13/658; H01R13/6477; H01R13/6585
Domestic Patent References:
JPH04181668A1992-06-29
JPH10270124A1998-10-09
JP2003257559A2003-09-12
JP2004534358A2004-11-11
JP2005063796A2005-03-10
JPH08213108A1996-08-20
JPH11329594A1999-11-30
Attorney, Agent or Firm:
Nobuo Kinutani