Title:
シールド端子付きコネクタ
Document Type and Number:
Japanese Patent JP7257512
Kind Code:
B2
Abstract:
A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
Inventors:
Kirk Bee Perosa
Vivek Shah
Andrew Collak
Dan Wenzel
Matt Cox
Aman Isaac
Vivek Shah
Andrew Collak
Dan Wenzel
Matt Cox
Aman Isaac
Application Number:
JP2021522988A
Publication Date:
April 13, 2023
Filing Date:
December 03, 2019
Export Citation:
Assignee:
Molex LLC
International Classes:
H01R13/6591
Domestic Patent References:
| JP3199094U | ||||
| JP2013073987A | ||||
| JP2018010724A | ||||
| JP2013038076A | ||||
| JP2019003816A |
Foreign References:
| CN206742586U | ||||
| US20140024257 | ||||
| US20160104976 | ||||
| US20090023336 | ||||
| US20030008560 | ||||
| WO2010030622A1 | ||||
| KR1020100091103A |
Attorney, Agent or Firm:
Toshiaki Aoki
Kawai Makoto
Kawai Makoto
Previous Patent: Algorithm selector based on image frames
Next Patent: PACKING METHOD OF LOADED SHEET ON PALLET BASE
Next Patent: PACKING METHOD OF LOADED SHEET ON PALLET BASE