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Title:
CONTACT ASSEMBLY
Document Type and Number:
Japanese Patent JP2007026941
Kind Code:
A
Abstract:

To provide a contact assembly for electrically connecting an integrated circuit device lead with a corresponding load board pad of a test apparatus.

This assembly includes a conductive frame seated within a chamber penetrating a casing separating the device lead and the load board pad. The frame has a reception part formed axially extending in its inside, and a conductive contact pin is received within the reception part so as to axially reciprocate. The contact pin has a first axial end engageable by the device lead and a second axial end engageable by a conductive spring. The spring energizes the contact pin toward the device lead. Further, the assembly includes means insulating the spring from the contact pin.


Inventors:
Brian, Sheposh W.
Brian, Warwick K.
William, Workowski
Application Number:
JP2005000208544
Publication Date:
February 01, 2007
Filing Date:
July 19, 2005
Export Citation:
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Assignee:
JOHNSTECH INTERNATL CORP
International Classes:
H01R13/187; H01R33/76
Attorney, Agent or Firm:
恩田 博宣
恩田 誠



 
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