Title:
接触子装置
Document Type and Number:
Japanese Patent JP4770752
Kind Code:
B2
Inventors:
Hideaki Shimazu
Hiroyuki Nakagawa
Hitoshi Sadakuni
Daisuke Fujita
Hiroyuki Sasao
Tatsuya Hayashi
Hiroyuki Nakagawa
Hitoshi Sadakuni
Daisuke Fujita
Hiroyuki Sasao
Tatsuya Hayashi
Application Number:
JP2007036042A
Publication Date:
September 14, 2011
Filing Date:
February 16, 2007
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01R13/187; H02B1/20; H02B13/02; H02G5/06
Domestic Patent References:
| JP52138264U | ||||
| JP7022114A |
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka