Title:
コンタクトおよびインタポーザ
Document Type and Number:
Japanese Patent JP5064205
Kind Code:
B2
Abstract:
A contact (10) for an interposer (1) for electrically connecting an array of first contacts (40) with a further array of second contacts (31). The contact (10) is in the form of a resilient loop comprising a spring section (11) with contact projections (121, 122) at diametrically opposed locations on the spring section (11) and a waisted portion (111) between the contact projections (121, 122). The waisted portion (111) is resiliently retained in a penetration hole (21) in the housing. The contact projections (121, 122) and adjacent part of the spring section (11) project from parallel penetration hole intersecting slits (22) in opposed front and rear surfaces (20a, 20b) of the housing (20).
Inventors:
Katsuhiko Sakamoto
Eiichiro Takemasa
Eiichiro Takemasa
Application Number:
JP2007337624A
Publication Date:
October 31, 2012
Filing Date:
December 27, 2007
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
H01R13/24; G01R1/067; G01R1/073; G01R31/26; H01R12/71; H01R31/06
Domestic Patent References:
| JP2007537579A | ||||
| JP11031540A | ||||
| JP2002134202A | ||||
| JP53067084U |
Attorney, Agent or Firm:
Masaki Yamada
Mikami Yui
Mikami Yui