Title:
CONTACT MODULE FOR MEASURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2015212676
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a contact module for measuring an electronic component that can accurately apply necessary pressure to the electronic component on a measurement socket with a simple constitution adaptively to increased pins of the electronic component and can obtain an accurate measurement result while preventing the electronic component from being broken.SOLUTION: While a pressurization plate (16A) is positioned above electronic components (22A, 22B) placed in measurement sockets (21A, 21B) of an electronic component measurement device (2), cam follower drive shafts (18A1, 18B1) of measurement pressurization mechanisms (19A, 19B) are driven horizontally to move the pressurization plate (16A) downward through a cam block (17), and the pressurization plate (16A) presses the electronic components (22A, 22B) against the measurement sockets (21A, 21B).
Inventors:
AIHARA TAKAMITSU
Application Number:
JP2014095972A
Publication Date:
November 26, 2015
Filing Date:
May 07, 2014
Export Citation:
Assignee:
SYNAX CO LTD
International Classes:
G01R31/26
Domestic Patent References:
| JP2013044684A | 2013-03-04 | |||
| JP2008190894A | 2008-08-21 | |||
| JP2006029943A | 2006-02-02 | |||
| JP2012109300A | 2012-06-07 | |||
| JPH10239390A | 1998-09-11 | |||
| JP2013044684A | 2013-03-04 | |||
| JP2008190894A | 2008-08-21 | |||
| JP2006029943A | 2006-02-02 | |||
| JP2012109300A | 2012-06-07 | |||
| JPH10239390A | 1998-09-11 |
Attorney, Agent or Firm:
Suzue International Patent Office
Satoshi Kono
Sadao Muramatsu
Shoji Suzue
Satoshi Kono
Sadao Muramatsu
Shoji Suzue
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