Title:
CONTACT SENSOR BETWEEN PART AND SUBSTRATE
Document Type and Number:
Japanese Patent JP3508221
Kind Code:
B2
Abstract:
PURPOSE: To provide a contact sensor between a part and a substrate which enables the mounting of the part such as IC chip at a low pressurizing force and is free from the deformation of a part of the part, for example, bumping of the IC chip.
CONSTITUTION: This sensor is provided with a mobile body 22, a shaft 25 which is arranged facing the mobile body 22 to be movable axially, a tool 26 provided on the shaft to support a part being allowed to load or unload, a first terminal part 23A arranged on the side of the mobile body 22 and a first terminal part 21A arranged on the shaft to contact the first terminal part 23A.
Inventors:
Honda, Takayuki
Kawatani, Norio
Yanagisawa, Yoshiyuki
Kawatani, Norio
Yanagisawa, Yoshiyuki
Application Number:
JP19196294A
Publication Date:
March 22, 2004
Filing Date:
July 22, 1994
Export Citation:
Assignee:
SONY CORP
International Classes:
G01L1/00; B23P21/00; B25J15/06; G01B7/00; G01B21/00; (IPC1-7): G01B21/00; B25J15/06
Attorney, Agent or Firm:
角田 芳末 （外１名）
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