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Title:
CONTACT STRUCTURE, METHOD OF MANUFACTURING CONTACT STRUCTURE AND ELECTROMAGNETIC RELAY
Document Type and Number:
Japanese Patent JP2017191759
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a contact structure, a contact structure manufacturing method and an electromagnetic relay that can further improve thermal conductivity from a contact portion to a conductive plate.SOLUTION: A contact structure 1a further includes a fillet portion 4 formed across a first surface 21 of a conductive plate 2 and a side surface 313 of a contact portion 31. The height of the fillet portion 4 from the first surface 21 gradually decreases as it goes away from the contact portion 31. The surface 411 of the outer peripheral portion 41 of the fillet portion 4 which is spaced apart from the contact portion 31 when viewed from the thickness direction of the conductive plate 2 is inclined with respect to the first surface 21 and formed of a part of the conductive plate 2 so that no step occurs between the fillet portion 4 and the first surface 21 in the direction away from the contact portion 31 along the first surface 21 of the conductive plate 2.SELECTED DRAWING: Figure 1

Inventors:
OKUBAYASHI TAKAMI
Application Number:
JP2016082379A
Publication Date:
October 19, 2017
Filing Date:
April 15, 2016
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
H01H1/06; H01H11/06; H01H50/54
Domestic Patent References:
JPH076651A1995-01-10
JPS5882726U1983-06-04
JP2007122931A2007-05-17
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki