Title:
CONTACT STRUCTURE
Document Type and Number:
Japanese Patent JP2001284421
Kind Code:
A
Abstract:
To provide a contact structure for performing electric connection with a contact target formed by manufacturing a contactor by micro machining technology on a semiconductor board.
The contact structure is composed of a contact board 20 and a plurality of contactors 30 mounted on the contact board 20. A contact bump 31 for being brought into contact with the contact target 320 is provided on each contactor 30. When the contactor 30 is pushed on the contact target 320, spring force is generated. Various types of the contact structures and their manufacturing method are disclosed.
Inventors:
KHOURY THEODORE A
FRAME JAMES W
FRAME JAMES W
Application Number:
JP2001044302A
Publication Date:
October 12, 2001
Filing Date:
January 17, 2001
Export Citation:
Assignee:
ADVANTEST CORP
International Classes:
G01R1/067; G01R1/073; G01R31/28; H01L21/66; H01R12/00; G01R31/26; H01R12/71; H01R13/24; H05K3/40; (IPC1-7): H01L21/66; G01R1/073; G01R31/26; G01R31/28