Title:
非接触洗浄モジュール
Document Type and Number:
Japanese Patent JP7304935
Kind Code:
B2
Abstract:
A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.
Inventors:
Langarajan, Jagan
Blank, Adrian
Gorbovsky, Edward
Jagannathan, Balasubramaneem Coimbatore
Zuniga, Stephen M.
Mikhailchenko, Ekaterina
Anderson, Michael A.
Domin, Jonathan Pea.
Blank, Adrian
Gorbovsky, Edward
Jagannathan, Balasubramaneem Coimbatore
Zuniga, Stephen M.
Mikhailchenko, Ekaterina
Anderson, Michael A.
Domin, Jonathan Pea.
Application Number:
JP2021505782A
Publication Date:
July 07, 2023
Filing Date:
August 05, 2019
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/304; B08B3/02; H01L21/677
Domestic Patent References:
| JP2011071477A | ||||
| JP2012004320A | ||||
| JP2013526054A | ||||
| JP2013236056A |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation