Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONTACTLESS SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JPH07220036
Kind Code:
A
Abstract:

PURPOSE: To reduce the production cost of the contactless semiconductor module where the electromagnetic induction system is used to perform data exchange by forming an antenna coil for data transmission/reception with a solenoid coil.

CONSTITUTION: An antenna coil 50 is fixed into an annular groove 20c, which is formed on the upper face of a frame in accordance with the shape of the frame 20, with an adhesive or the like. The antenna coil 50 consists of the solenoid coil formed by winding a conductor in accordance with the size of the annular groove 20C and fixing it with an adhesive or the like. The antenna coil 50 and a circuit board 30 are connected with a groove 20d, which is formed on the inside of the frame 20, between them. The groove 20d is made deeper than a panel reception part 20a so that both ends of the antenna coil 50 are extended to the circuit board 30 on the inside of the frame 20 even at the time of attaching a panel 7 to the panel reception part 20a. Since the antenna coil 50 consists of the solenoid coil and is provided in the frame in this manner, the production cost is reduced.


Inventors:
WASHIDA TETSUO
MAEDA HAJIME
ONODA SHIGEO
MURASAWA YASUHIRO
OCHI KATSUNORI
OBUCHI ATSUSHI
Application Number:
JP1281994A
Publication Date:
August 18, 1995
Filing Date:
February 04, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B42D15/10; G06K19/07; G06K19/077; G11C5/00; (IPC1-7): G06K19/07; B42D15/10; G06K19/077; G11C5/00
Attorney, Agent or Firm:
Soga Doteru (6 people outside)



 
Previous Patent: band saw

Next Patent: IC CARD AND IC CARD READER/WRITER