Title:
CONTACTLESS TYPE IC MEDIA AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3897160
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To lower costs, to make mass-production efficient, and to improve durability as to contactless type IC media which send and receive information without contacting and a manufacturing method therefor.
SOLUTION: An interposer 32 having an IC module previously mounted between connection land parts is made to correspond to between land parts of an antenna part 31 and electric connections are made to form an RF-ID module. This RF-ID module is interposed as a transferred RF-ID module 13 between a heat-sensitive sheet 12 and a base material sheet 12 of a double coated adhesive sheet 14 across an adhesive 22. In this case, at least the antenna part 31 is formed on a peeling function part and transferred to the double coated adhesive sheet 14.
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Inventors:
Yasuhiro Endo
Toru Maruyama
Toru Maruyama
Application Number:
JP2002089088A
Publication Date:
March 22, 2007
Filing Date:
March 27, 2002
Export Citation:
Assignee:
Toppan Forms Co., Ltd.
International Classes:
B42D15/10; G06K19/077; G06K17/00; G06K19/00; G06K19/07; G09F3/00; G09F3/10; (IPC1-7): G06K19/077; B42D15/10; G06K17/00; G06K19/00; G06K19/07; G09F3/00; G09F3/10
Domestic Patent References:
| JP10236041A | ||||
| JP2001039060A | ||||
| JP2001240218A | ||||
| JP2000338874A | ||||
| JP2002505488A | ||||
| JP2002074304A | ||||
| JP2001034732A |
Foreign References:
| WO2001062517A1 |
Attorney, Agent or Firm:
▲高▼橋 寛