To give the charge preventive performance to the container in the less dimentional change while minimizing the production of abrasive particles and volatile component thereof, by a method wherein the component of the part in contact with semiconductor material is made of the composition containing carbon material and aliphatic polyketone, while specifying the surface resistivity of this component member.
A semiconductor wafer container 1 comprises opposing sidewalls 2a, 2b, a side end wall 3 connecting one end sidewalls 2a, 2b and a bridge supporting part 4 connecting the other end of the sidewalls 2a, 2b. Furthermore, in order to contain discal semiconductor wafers aligned in parallel in the arrow direction, the trenches 6a, 6b holding the side ends of the semiconductor wafers are oppositely bore inner surfaces 5a, 5b of the sidewalls 2a, 2b. In the container 1, the component member of the part in contact with the semiconductor material is made of a resin composition containing a carbon material and aliphatic polyketone as the essential components in the surface resistivity of 108-1012 Ω/sq.
TAKAGI MASATO
NAKAMURA MASASHI
