PURPOSE: To provide a container suitable for the reception of semiconductor devices of different shapes for use in a pair.

CONSTITUTION: The receiving parts 13 and 14 are formed to flatly receive the IC's of different shapes, e.g. CCD 11 and ROM IC 12. The receiving part is composed of a case body 10 provided with protecting grooves 18 and 20 for protecting IC leads and a lid 30 provided with pressing parts 31 and 34 for pressing the upper surfaces of the IC's to prevent them from being raised. In this way main IC bodies and their leads can be protected and received flatly in the case and, therefore, arranged unmistakably in an adjacent pair. Due to such a flat IC arrangement, moreover, this case has the advantage of making an automatic IC reception and removal possible with ease.