Title:
CONTINUOUS ELECTROPLATING METHOD
Document Type and Number:
Japanese Patent JPH05287584
Kind Code:
A
Abstract:
PURPOSE:To prevent the generation of low-current defects at the time of electroplating the surface of a steel strip with plural path energizations by setting and controlling the current density of the first path based on the preset current density and a value calculated from the steel strip width and electrode length but not on the line speed. CONSTITUTION:A long-sized steel strip is passed through the plating soln. in plural plating baths provided with plural electrodes, a DC current is applied between each electrode and the strip to electroplate the strip. In this case, the current density of each electrode is controlled so that a specified coating weight is obtained for the strip. At this time, the plating current per electrode divided by the product of the length and width of one electrode in the strip traveling direction is defined as the current density which is connected with the low current defect generated when the current density lies outside the lower limit of the optimum plating current density. The current density of the first electrode is predetermined, and the current density of the first electrode is set and controlled based on the value calculated from the preset current density, the strip width and electrode length but not on the line speed.
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Inventors:
KUWAYAMA MICHIO
OBA NAOYUKI
OBA NAOYUKI
Application Number:
JP11421092A
Publication Date:
November 02, 1993
Filing Date:
April 08, 1992
Export Citation:
Assignee:
NIPPON KOKAN KK
International Classes:
C25D5/26; C25D7/06; C25D21/12; (IPC1-7): C25D7/06; C25D5/26; C25D21/12
Attorney, Agent or Firm:
Takehiko Suzue