PURPOSE: To control the heat rays to be radiated to a chip packaging substrate and to uniformly distribute temp. in the substrate by providing a shielding plate which partly shields the heat rays radiated from an IR heater to the inside of a heating chamber.
CONSTITUTION: The chip packaging substrate 7 is placed on an endless transport conveyor 3 so as to travel in an arrow A direction and is carried into the tunnel-shaped heating chamber 2. The IR rays radiated from the IR heater 4 which is a heating source are partly removed by the shielding plate 5 to maintain the uniform temp. in the substrate in the transverse direction of the conveyor at which cream solder is heated to melt and the reflow soldering of electronic parts is executed. The reflow soldering of the electronic parts which are mounted on the substrate and are susceptible to heat is thereby made possible and the defective soldering is eliminated with decreased thermal damages.
MIYAKE HIROYUKI
SAITO SUSUMU
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