CONTINUOUS PLATING METHOD FOR NI-W ALLOY

Japanese Patent JP3104704

B2

PROBLEM TO BE SOLVED: To allow continuous plating without aging a plating liquid in electroplating of an Ni-W alloy.
SOLUTION: A plating device of a two-tank structure separated to an anode chamber and a plating chamber by using a cation exchange membrane is used in the electroplating of the Ni-W alloy, by which the oxidation decomposition of an organic complexing agent contained in the plating liquid on anodes is suppressed. The nickel component and tungsten component in the plating liquid are replenished according to a deposition quantity by using the two soluble anodes of metal nickel and metal tungsten, by which the continuous plating is executed without aging the plating liquid.

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Morikawa, Tsutomu
Yokoi, Masayuki
Nakade, Takao
Sato, Yukihiro
Ishida, Kohei
Yuya, Susumu

JP1999000341785

September 01, 2000

December 01, 1999

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Osaka, Prefecture
NOMURA PLATING CO LTD
UINGU:KK

C25D3/56; C25D17/00; C25D17/10; (IPC1-7): C25D17/00; C25D3/56; C25D17/10

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