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Title:
CONTINUOUS SOLID-PHASE POLYMERIZATION OF NYLON 66, APPARATUS FOR CONTINUOUS SOLID-PHASE POLYMERIZATION AND NYLON 66 FIBER
Document Type and Number:
Japanese Patent JP2000198841
Kind Code:
A
Abstract:

To carry out a solid-phase polymerization of a polyamide of stabilized quality by preventing mutual polyamide chips from fusing and clogging the interior of a vessel.

Nylon 66 chips prepared by heating up the chips subjected to underwater strand granulated(USG) cutting to ≥150°C while stirring the chips and crystallizing the chips so that the crystallinity of the chip surfaces is ≥11% after a liquid-phase polymerization are used as the nylon 66 chips fed to a solid-phase polymerization in the continuous solid-phase polymerization method for the nylon 66 comprising making the nylon 66 chips flow down in the form of a layer, heating the nylon 66 chips at 150-200°C with an inert gas countercurrently fed from the lower side and carrying out the solid-phase polymerization.


Inventors:
YAMADA HIROYUKI
MEGATA HIROYOSHI
HORI HIDEO
Application Number:
JP154199A
Publication Date:
July 18, 2000
Filing Date:
January 07, 1999
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08G69/28; C08G69/30; D01F6/60; (IPC1-7): C08G69/30; C08G69/28; D01F6/60