Title:
輪郭線解析装置、加工寸法抽出システム、処理条件決定システム及び半導体装置製造システム
Document Type and Number:
Japanese Patent JP7345665
Kind Code:
B2
Abstract:
This invention carries out highly accurate fitting to a complex shape that can be generated by semiconductor processing. A shape model derives shape model parameter constraints on the basis of a machining dimension domain and a machining dimension function that is a unicursal curve from a start point to an end point around a shape that is a combination of one or more ellipses and one or more line segments on an xy plane defined by orthogonal x and y axes, represents machining dimensions specified with a singularity in the shape model as a reference, and has shape model parameters as variables.
Inventors:
Naoto Takano
Nakata Encyclopedia
Takeshi Ohmori
Yutaka Okuyama
Nakata Encyclopedia
Takeshi Ohmori
Yutaka Okuyama
Application Number:
JP2022539011A
Publication Date:
September 15, 2023
Filing Date:
July 14, 2021
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
G01B15/04; H01J37/28; H01L21/66
Domestic Patent References:
| JP2009198339A | ||||
| JP2013073376A |
Attorney, Agent or Firm:
Polaire Patent Attorneys Corporation
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