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Title:
CONTROL CIRCUIT BOARD AND CIRCUIT CONSTRUCT
Document Type and Number:
Japanese Patent JP2004253759
Kind Code:
A
Abstract:

To stabilize the quality and to improve the reliability of the joint between a control circuit board 20 and an external circuit.

When the conductor of a bus bar 14 or the like is connected to the control circuit board 20, a notch section 20a having a shape opened toward a side is formed at the edge of the control circuit board 20 and a conductor layer 24 is deposited to the edge of the control circuit board 20. Soldering 26 is performed so that the solder spreads over the conductor layer 24 and the busbar 14 while they are overlapped.


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Inventors:
TAKAGI KOICHI
MIZUNO FUMIAKI
Application Number:
JP2003174298A
Publication Date:
September 09, 2004
Filing Date:
June 19, 2003
Export Citation:
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Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01R13/66; H02G3/16; H05K1/11; H05K1/14; H05K3/20; H05K3/34; H05K5/00; H05K7/06; H05K7/20; H05K3/40; H05K3/42; (IPC1-7): H05K1/11; H01R12/06; H01R13/66; H02G3/16; H05K1/14; H05K7/06
Domestic Patent References:
JPH07183451A1995-07-21
JP2002142333A2002-05-17
JPH0467377U1992-06-15
JP2002015805A2002-01-18
JPH10241759A1998-09-11
JP2001211529A2001-08-03
JPH0983131A1997-03-28
JP2002280687A2002-09-27
JP2001286037A2001-10-12
JPH09172239A1997-06-30
Attorney, Agent or Firm:
Etsushi Kotani
Kyuichi Ueki
Muramatsu Toshiro



 
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