Title:
制御装置の製造方法および制御装置
Document Type and Number:
Japanese Patent JP7028959
Kind Code:
B2
Abstract:
This control device (17) production method comprises: the step of inserting each terminal (28) of at least two semiconductor elements (21) into terminal holes (30) passing through a plate-shaped printed circuit substrate (18); the step of inserting coupling screws (36) through large opening holes passing through the printed circuit substrate (18) at the specific positions where the semiconductor elements (21) are mounted and coupling the semiconductor elements (21) to a heatsink (23) via the coupling screws (36), each large opening hole having an opening size allowing all of a coupling screw (36) to be inserted therethrough; and the step of soldering the terminals (28) that have been inserted into the terminal holes (30).
More Like This:
| JPS62234358 | FIXING DEVICE FOR SEMICONDUCTOR ELEMENT |
Inventors:
Toshiki Morihiro
Hiroyuki Morimoto
Kosuke Koyama
Hiroyuki Morimoto
Kosuke Koyama
Application Number:
JP2020507200A
Publication Date:
March 02, 2022
Filing Date:
March 22, 2018
Export Citation:
Assignee:
Toshiba Carrier Co., Ltd.
International Classes:
H01L23/40; F24F1/22; H05K7/20
Domestic Patent References:
| JP2004095697A |
Foreign References:
| US4593342 | ||||
| US20050022970 | ||||
| WO2006030606A1 |
Attorney, Agent or Firm:
Patent business corporation Tokyo International Patent Office
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