To provide a control method of an electrolytic polishing pad for certainly and favorably polishing an article even in a case of doing it in combination of CMP and electrolytic polishing.
This is the control method of the electrolytic polishing pad 3 used by being pressed and slid on the polishing article 1 and constituted to electrify an electrolytic electric current for electrolytic polishing in an electrolytic solution, and it detects lowering of a polishing rate of the electrolytic polishing pad 3 in accordance with a friction coefficient μ provided by monitoring or a change of electric resistance R by monitoring the friction coefficient μ between the polishing article 1 and the electrolytic polishing pad 3 or the electric resistance R at the time of the electrolytic polishing pad 3 electrifying the electrolytic electric current. Additionally, the polishing rate is recovered by a mechanical polishing process, a chemical polishing process or an electric polishing process applied on a surface of the electrolytic polishing pad 3 in case of detecting lowering of the polishing rate.
NOGAMI TAKESHI
KOMAI HISANORI
YASUDA YOSHIYA
OTORII SUGURU
TAKAHASHI SHINGO
HORIKOSHI HIROSHI
TAI KAORI
