Title:
CONTROL SYSTEM IN ETCHING DEVICE
Document Type and Number:
Japanese Patent JPS6161421
Kind Code:
A
Abstract:
PURPOSE:To enable to get the sectional configuration of a layer to be etched nearer the desired configuration by a method wherein the secular change pattern in the anisotropic degree of an etching rate is found out according to the desired sectional configuration and the secular change pattern in the anisotropic degree is converted into the secular change pattern of the setting conditions for the etching device. CONSTITUTION:The control program and the conditional table for on etching device are incorporated in a CPU 701. An experiment is conducted in advance on the device setting conditions at a gas flow rate, a high-frequency power and a stage temperature and the conditional table is made out. The operator inputs data on the desired sectional configuration of a layer to be etched and the position of the mask at the starting time of etching onto a tablet 703 and the CPU reads in the coordinate data. Moreover, the initial value of the ratio of selectivity and the absolute value of the etching rate are keyed in by a keyboard 702 and the CPU 701 finds out the secular change pattern PX of the setting conditions for the etching device and the evaluation value thereof and makes the etching device 706 operate while the CPU changes hourly the setting conditions according to the PX through a microcomputer 705.
Inventors:
TAKEUCHI YOICHI
ONARI MIKIHIKO
YOSHIHARA IKUO
FUNABASHI SEIJU
KOIKE ATSUYOSHI
ONARI MIKIHIKO
YOSHIHARA IKUO
FUNABASHI SEIJU
KOIKE ATSUYOSHI
Application Number:
JP18262784A
Publication Date:
March 29, 1986
Filing Date:
September 03, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C23F4/00; H01L21/302; H01L21/3065; (IPC1-7): C23F4/00; G03F7/00
Attorney, Agent or Firm:
Akio Takahashi