Title:
制御器およびこれを含むモータ組立体
Document Type and Number:
Japanese Patent JP7148603
Kind Code:
B2
Abstract:
An embodiment relates to a controller and a motor assembly comprising same, the controller comprising: a substrate; a controller housing disposed on the substrate; a CM filter unit disposed between the substrate and the controller housing; a DM filter unit disposed under the CM filter unit; a controller cover disposed between the substrate and the DM filter unit; a power module unit disposed between the substrate and the controller cover; and a connector unit coupled to the substrate, wherein the power module unit comprises a power module and a mold unit surrounding the power module. Accordingly, the heat generating problem of the power module unit can be resolved.
Inventors:
Kim, Chang Suk
Song, Kun Young
Song, Dak Hyun
Song, Kun Young
Song, Dak Hyun
Application Number:
JP2020515702A
Publication Date:
October 05, 2022
Filing Date:
July 27, 2018
Export Citation:
Assignee:
LG Innotek Company Limited
International Classes:
H02M7/48; H02K11/33
Domestic Patent References:
| JP2010187436A | ||||
| JP2011030405A |
Foreign References:
| WO2015119224A1 | ||||
| WO2014033833A1 | ||||
| WO2015122069A1 |
Attorney, Agent or Firm:
Makoto Ono
Kanayama Sage
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Takashi Kono
Yoshikazu Iwase
Kanayama Sage
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Takashi Kono
Yoshikazu Iwase