Title:
TRANSFER MECHANISM
Document Type and Number:
Japanese Patent JP2017069370
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce useless standby time of a wafer processing apparatus.SOLUTION: A transfer mechanism (3) for transferring a wafer unit (WU), supporting a wafer (W) on an annular frame (F) via an adhesive tape (T), between a plurality of wafer processing apparatuses (2) includes a housing tray (40) for housing the wafer unit, and transfer means (50) for transferring the housing tray between the wafer processing apparatuses. The housing tray has a placement section (43) where the annular frame of the wafer unit is placed, and first and second positioning rollers (44, 45) for positioning flat surfaces (55, 56) formed on the circumference of the annular frame. The wafer units, positioned in the housing tray, are transferred one-by-one by the transfer means.SELECTED DRAWING: Figure 4
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Inventors:
OGAWARA SATOSHI
Application Number:
JP2015192788A
Publication Date:
April 06, 2017
Filing Date:
September 30, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/677; B65G49/07; H01L21/301; H01L21/673
Domestic Patent References:
| JP2001313278A | 2001-11-09 | |||
| JP2013082045A | 2013-05-09 | |||
| JPH01220454A | 1989-09-04 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki