PURPOSE: To improve a yield in an inspecting process for a semiconductor device by a method wherein when the result of inspection shows imperfection successively in the prescribed number of times or more, an inspecting device at that position of inspection is judged to be faulty.

CONSTITUTION: A driving means 10 gives an instruction to a driving element 4 so that a semiconductor device be moved to positions A to D of inspection of an inspecting element 5. While giving an inspection start instruction to each arbitrary position of inspection of the inspecting element 5, an inspecting means 11 receives the result of inspection from the inspecting element 5 after the inspection is ended. A fault detecting means 12 monitors the result of inspection which the means 11 receives from the inspecting element 5, and when imperfection occurs successively in the prescribed number of times or more, it judges an inspecting device to be faulty and gives a signal to the means 10 so as not to move the semiconductor device 1. A control means 13 controls the means 10 to 12 generally. According to this method, a yield in an inspecting process for the semiconductor device 1 is improved.