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Patent Searching and Data


Title:
CONVEYING MECHANISM FOR WIRING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2008273686
Kind Code:
A
Abstract:

To provide a conveying mechanism for conveying a wiring circuit board by a conveying ring between production processes with different conveying speeds when wiring circuit boards such as BGA boards are manufactured and hard to cause the defects such as the deformation and shortage of fine wiring patterns formed on the wiring circuit board and breakage of wire.

This conveying mechanism for conveying the wiring circuit boards by the conveying ring between the production processes with different conveying speeds when the wiring circuit boards such as BGA boards are manufactured comprises a drivingly conveying ring 10a having the conveying ring fixed to a rotating shaft and a drive releasing conveying ring 10b from which a rotating driving from the rotating shaft is released. The fixing of the conveying ring to and the releasing thereof from the rotating shaft are set arbitrarily according to the size and type of the wiring circuit board.


Inventors:
OKANO TATSUHIRO
Application Number:
JP2007118618A
Publication Date:
November 13, 2008
Filing Date:
April 27, 2007
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65G13/02; B65G39/04