To provide a conveying member with a cleaning function which has a cleaning layer having substantially no adhesive strength, the conveying member with the cleaning function having a superior conveying performance and also having a foreign matter removing performance uniformly over the entire surface of a chuck table including a periphery of an edge, and further effectively preventing foreign matter and dirt from sticking on nearby a wafer edge part as a handling portion for a wafer and also effectively preventing foreign matter and dirt from sticking on a wafer contact portion of a mechanical fixation system, and to provide a method of manufacturing such the conveying member with a cleaning function.

The conveying member with the cleaning function has the cleaning layer 20. The cleaning layer 20 has substantially no adhesive strength, and the cleaning layer is formed continuously covering one entire surface 51 of a conveying member, an edge part 52 of the conveying member, and a part 53 of the other surface of the conveying member.

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