Title:
CONVEYING METHOD AND DEVICE FOR LEAD FRAME
Document Type and Number:
Japanese Patent JPS5588351
Kind Code:
A
Abstract:
PURPOSE:To simplify a through assembly mechanism by a method wherein pitch arrangement of a feed pin is adjusted to a full length of the longest continuous material, and the feed pitch is corrected accordingly for continuous material shorter than that, for the intermittent conveyance of continuous materials in basic size of lead frames. CONSTITUTION:There is provided a feed pin mechanism having the same pitch p1 as a full length of the basic-sized continuous material longest of all basic-sized continuous materials of lead frames consisting integrally of a plural lead. Further provided are reciprocation rocking mechanisms 9, 15 to reciprocate a pin horizontally and also to rock vertically and cam mechanisms 10, 16 to reciprocate and rock the reciprocation rocking mechanisms; the longest continuous material is then fed in normal pitch, and the continuous material of length p2 shorter than that is fed in a pitch corrected for a shortage q in length. When conveying lead frames for resin- seal semiconductor device assembly, a change in description can be complied with simply by changing two cams of the cam mechanisms.
Inventors:
SUMIYA OSAMU
SHIMATA TSUTOMU
SHIMIZU TAKESHI
OZAWA MASAKAZU
SHIMATA TSUTOMU
SHIMIZU TAKESHI
OZAWA MASAKAZU
Application Number:
JP15985778A
Publication Date:
July 04, 1980
Filing Date:
December 27, 1978
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; H01L21/67; H01L21/68; (IPC1-7): H01L21/60; H01L21/68