To provide cooler for an LD bar which realizes cooling power, thickness, mechanical strength, low cost and low pressure loss structure, and a light source apparatus using the cooler.
The cooler 67, composed of a laminate of plate members 29-31 having grooved or opened channels comprises an LD array 2 fixed with solder, such as Pb-Sn alloy, etc., onto the plate member 31 of the uppermost layer of the apparatus along its front end face 11, and metal plate 71 fixed via an insulation plate 70. The electrodes of the LD array 2 at a semiconductor substrate side are electrically connected to the metal plate through a wiring metal film, etc. Between the insulation plate 70 and the metal plate 71, a leak- preventing sealing member 72 is disposed, having openings larger than an inlet and outlet openings 4, 5, at positions corresponding to these openings 4, 5. A refrigerant will be fed and discharged through the openings 4, 5 to effectively cool the LD array 2.
SAKANO TETSURO
NISHIKAWA YUJI
SATO MASAO
NAITO MASAYA
MIYATA RYUSUKE
HAYANO KOJI
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