Title:
COOLER AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023110327
Kind Code:
A
Abstract:
To provide a technique capable of restraining solder material from clogging at an opening of a pipeline which is adjacent to a heating element and through which a coolant flows.SOLUTION: A cooler 200 includes a cooling pipe 226 which is adjacent to a semiconductor package 100 and through which a coolant flows, and a header 240 to which one end of the cooling pipe 226 is fixed. The header 240 has outer wall portions 242 and 243, a material of a melting point lower than that of a base material thereof being laminated on the inner surfaces thereof, and by melting the material, a brazing material being supplied to braze the outer wall portions 242 and 243 with a predetermined member, and an inflow restraining portion (for example, a bank portion 241C, a recessed portion 241D, a groove portion 243B, etc.) that restrains the brazing material melted from the outer wall portions 242 and 243 during brazing from flowing into cooling pipe 226 through an inner bottom portion of the header 240 in a predetermined posture state.SELECTED DRAWING: Figure 13
Inventors:
SANUKI YASUTAKA
SUZUKI YUJI
FUJIMOTO YUUJI
SUZUKI YUJI
FUJIMOTO YUUJI
Application Number:
JP2022011700A
Publication Date:
August 09, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/473; B23K1/00; B23K1/20; B23K33/00; H02M7/48
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito