To fully obtain cooling performance on an upper side of a heat receiving plate to increase cooling efficiency of a cooling device.
A heat receiving unit 8 includes: a heat receiving plate 12 which is brought into contact with a semiconductor switching element 6 as a heat generator, for absorbing heat; a heat receiving cover 14 covering the surface of the heat receiving plate 12 to form a heat receiving space 13 that evaporates a refrigerant 10 flowing thereinto; an inlet 15 through which the condensed refrigerant 10 flows into the heat receiving space 13; and an outlet 16 for discharging the refrigerant 10 from the heat receiving space 13. A circulation path 11 is constituted of a heat dissipating path 11a and a return path 11b. The heat dissipating path 11a connects the outlet 16 with a heat dissipating body 17 of a heat dissipating unit 9. The return path 11b connects the heat dissipating body 17 of the heat dissipating unit 9 with the inlet 15. An inner diameter at the tip of an introducing pipe 23 that is disposed on the side of the heat receiving space 13 of the inlet 15 is larger than an inner diameter of an inflow pipe 24 that is disposed on the side of the heat dissipating path 11a of the inlet 15.
NOGAMI WAKANA
SUZUKI AYAKA
| JP2009088127A | 2009-04-23 | |||
| JPS5588363A | 1980-07-04 | |||
| JPH1075583A | 1998-03-17 | |||
| JP2009088125A | 2009-04-23 | |||
| JP2013083413A | 2013-05-09 |
Daisuke Nagano
Kentaro Fujii
Next Patent: HEAT PUMP SYSTEM