To provide a cooling device which improves the endothermic performance for heat generated from a high heat generating electronic component, and to provide an electronic apparatus including the cooling device.
A cooling device performs cooling through circulation of a hydraulic fluid and includes: a box shaped heat reception part 3 for transmitting heat to a heat receiving surface 3a corresponding to one surface of an outer wall where a MPU 1 is provided; a pipe conduit 5b for injecting the hydraulic fluid to the heat reception part 3; a pipe conduit 5a for discharging steam formed by the injected hydraulic fluid vaporized by heat of the heat receiving surface 3a; and a heat radiation fin 7 provided above the heat reception part 3 and discharging heat of the steam transferred by the pipe conduit 5a. An opening of the pipe conduit 5b is provided in the vicinity of the heat receiving surface 3a so as to face the heat receiving surface 3a, and a non-return valve 6 is provided at the pipe conduit 5b.
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Kentaro Fujii
Ikuro Terauchi
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