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Title:
COOLING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2011124456
Kind Code:
A
Abstract:

To provide a cooling device that can efficiently cool a heat generating body having a large calorific volume even though it is extremely compact in size and can reduce a mounting volume.

The cooling device 1 includes a substrate 2 where a recess 6 is formed at a first surface 3, a plurality of radiation fins 5 erected on a second surface 4 at the opposite side to the first surface 3, and a plate-like thermal diffusion section 7 housed in the recess 6. The upper surface 8 of the thermal diffusion section 7 is thermally in contact with the upper surface 10 of the recess 6, and the side surface 9 of the thermal diffusion section 7 is thermally in contact with the side surface 11 of the recess 6. The thermal diffusion section 7 diffuses heat generated from a heat generating body 19 provided on the lower surface of the thermal diffusion section 7 in the plane direction and the vertical direction by the vaporization and condensation of a refrigerant sealed therein.


Inventors:
NAGASAWA HIDEO
Application Number:
JP2009282318A
Publication Date:
June 23, 2011
Filing Date:
December 12, 2009
Export Citation:
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Assignee:
MOLEX INC
International Classes:
H01L23/427; F28D15/02; G06F1/20; H05K7/20
Domestic Patent References:
JPH11195738A1999-07-21
JP2002064170A2002-02-28
JP2009266941A2009-11-12
JP2002009215A2002-01-11
Attorney, Agent or Firm:
Mizoguchi