Title:
COOLING DEVICE AND ELECTRONIC EQUIPMENT MOUNTED WITH THE SAME
Document Type and Number:
Japanese Patent JP2014163519
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pipe type cooling device for cooling efficiently.SOLUTION: A cooling device is configured by: a hollow base part 10 in which a heat receiving part 3 is provided where a heating element 52 is attached on one surface; a plurality of hollow heat radiation pins 5 which are protrusively provided on a surface facing the heat receiving part 3 of the base part 10 and whose inside communicates with the inside of the base part 10; and hydraulic fluid 11 sealed inside the base part 10 and the heat radiation pin 5. An inner wall of the heat radiation pin 5 is made to be a taper-shape so that an inside diameter of the heat radiation pin 5 becomes larger from a tip part toward the base part 10 side. Thus, cooling can be performed efficiently.
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Inventors:
SHIBATA HIROSHI
MATSUI MASAFUMI
YASUI NOBUYUKI
HOSONO SHIGEYUKI
SUGIYAMA MAKOTO
SUZUKI AYAKA
MATSUI MASAFUMI
YASUI NOBUYUKI
HOSONO SHIGEYUKI
SUGIYAMA MAKOTO
SUZUKI AYAKA
Application Number:
JP2013031684A
Publication Date:
September 08, 2014
Filing Date:
February 21, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
F28D15/02; H01L23/427
Attorney, Agent or Firm:
Hiroki Naito
Fujii Kentaro
Terauchi Italian 久郎
Fujii Kentaro
Terauchi Italian 久郎