To increase the cooling performance and reduce a size of a cooling device which is connected to a cooled body such as a semiconductor element and can be switched between a low-load operation and a high-load operation.
A cooling body formed of a solid material which is connected to the cooled body is filled with heating medium. The heating medium is a mixture of a phase change material which repeats congealing and melting depending on the temperature, and a shape retention agent for retaining the shape of the phase change material at the time of melting and at the time of congealing. During the low-load operation wherein the cooled body generates little heat, cooling is performed only by the solid cooling body. During the high-load operation wherein the cooled body generates much heat, cooling is performed by both the solid cooling body and the heating medium using the latent heat of melting of the phase change material.
Yoshihide Komada
Kiyoshi Matsuzaki
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