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Patent Searching and Data


Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2008215761
Kind Code:
A
Abstract:

To solve problems of a conventional cooling device and to provide an easily maintainable cooling device.

The cooling device 1 is provided with: a cooling tower 2 including a cooling unit 24 connected to a supply pipe, unto which cooled fluid flows in, and a return pipe, from which the cooled fluid flows out, and a water spray hole 21a for cooling the cooling unit 24; and chiller unit 3 including compressors 31a and 31b, condensers 32a and 32b, expansion valves 34a and 34b, evaporators 33a and 33b, and has a refrigerant pipe line for circulating refrigerant through these components in this order. The condensers 32a and 32b are arranged inside the cooling tower 2, and heat exchange is carried out between the refrigerant compressed by the compressors 31a and 31b and a cooling medium fed from the water spray hole 21a. In the cooling device 1, the cooling unit 24 and the condensers 32a and 32b are supported by separate frame bodies 51 and 53, while the cooling unit 24 and the condensers 32a and 32b are connected separably in the vertical direction via a coupling part 513.


Inventors:
HATANO KATSUTOSHI
KINOSHITA YUSUKE
Application Number:
JP2007056709A
Publication Date:
September 18, 2008
Filing Date:
March 07, 2007
Export Citation:
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Assignee:
HITACHI METALS LTD
International Classes:
F28F25/00; F25B39/04; F28C1/00