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Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2013030736
Kind Code:
A
Abstract:

To provide a cooling device which equalizes temperatures between heating elements and prevents the occurence of the heating elements that are not easily cooled even when multiple heating elements, having different heating values, are mounted.

A cooling device comprises: a heat receiving block thermally connecting with heating elements; multiple first heat conduction members thermally connecting with the heat receiving block; and heat radiation fins thermally connecting with the multiple first heat conduction members. A flow of cooling air is set in a direction parallel to a surface of the heat receiving block. The multiple first heat conduction members thermally connect with second heat conduction members, and the multiple first heat conduction members are thermally connected with each other through the second heat conduction members.


Inventors:
YAMADA YUTAKA
HASHIMOTO NOBUYUKI
ISEMURA MASAKAZU
SATO KOSUKE
Application Number:
JP2012035333A
Publication Date:
February 07, 2013
Filing Date:
February 21, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H05K7/20; F28D15/02; H01L23/36; H01L23/427; H01L25/07; H01L25/18
Domestic Patent References:
JPH04225790A1992-08-14
JP2004254387A2004-09-09
JPH07190655A1995-07-28
Attorney, Agent or Firm:
Kouji Akanekubo
Shuichi Sumiyoshi
Yasushi Miyagi