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Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2013100977
Kind Code:
A
Abstract:

To provide a cooling device which has a strong capillary force, is not affected by gravity, has a sufficient flow rate of working fluid, and prevents reduction in transportation function.

A unidirectional copper fiber assembly 8 is mounted by a sintering process on an inner wall of a heat pipe 3 along the longitudinal direction of the heat pipe 3. A strong capillary force to be generated by the fine copper fiber assembly 8 transports purified water without being affected by gravity. A flow rate just enough to prevent the purified water from drying out due to evaporation can be maintained, thereby preventing reduction in a transportation function of the purified water as a cooling device. The unidirectional copper fiber assembly 8 is mounted along the longitudinal direction of heat pipe 3, so that the purified water smoothly flows in the longitudinal direction of heat pipe 3, to prevent reduction in the transportation function of the purified water. The copper fiber assembly 8 is mounted by the sintering process on the inner wall of the heat pipe 3, thereby successfully maintaining heat conduction of a pipe body and the copper fiber assembly 8, to increase heat resistance of the heat pipe 3.


Inventors:
MOTOMURA OSAMU
KOJIMA NOBUYUKI
SAKUMA NAOTO
ITO NOBUO
Application Number:
JP2012005509A
Publication Date:
May 23, 2013
Filing Date:
January 13, 2012
Export Citation:
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Assignee:
TOSHIBA HOME TECH CORP
International Classes:
F28D15/02
Domestic Patent References:
JP2003247791A2003-09-05
JP2009168326A2009-07-30
JP3113249U2005-09-02
JPS5229655U1977-03-02
Attorney, Agent or Firm:
Mamoru Ushiki
Tomoyuki Takahashi