To thin a cooling device without deterioration in cooling performance caused by the dryout of a wick in the cooling device using a loop type heat pipe having a plate evaporator.
A cooling device which includes an evaporator 10 with a built-in wick 14, a condenser, and a loop type heat pipe which connects the evaporator and condenser in a loop and includes a liquid pipe and vapor pipe, wherein the evaporator 10 is divided into a first case 10U connected to the liquid pipe 4 and a second case 10L connected to a steam pipe 5 and wherein a plurality of discharge ports 13A of working fluids and the wick 14 in which the working fluid from the discharge ports 13A is completely permeated are arranged at the connecting part between the two cases. The wick 14 includes projecting parts 14B which have recessed parts 14A corresponding to the discharge ports 13A, while the outer circumferential surfaces of the projecting parts 14B are provided with grooves 14C. The working fluid which permeates the wick 14 is changed into vapor by heat inside the second case 10L, is reserved in the steam chamber 17 and is discharged to the liquid pipe 5, and thus, the dryout of the wick 14 is prevented.
OGATA SHIN
| JP2009115396A | 2009-05-28 | |||
| JP2007247931A | 2007-09-27 |
| WO2012049752A1 | 2012-04-19 |
Koichi Itsubo
Higuchi Souji
Ryu Kobayashi
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