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Title:
COOLING AND HEATING STRUCTURE FOR FLOOR AND CEILING
Document Type and Number:
Japanese Patent JPH09119670
Kind Code:
A
Abstract:

To realize a low-cost floor heating by forming a gap layer between a front layer floor material and a lower layer receiving member, partitioning the gap layer by partition material to form a plurality of spaces, containing vessels filled with water in the respective spaces to form a floor body, and extending a solar light receiver at the part of the vessel.

A gap layer is formed between a front surface floor material 11 and a lower layer receiving member 12, the gap layer is partitioned by partition material to support and partition the gap layer to form a plurality of spaces, vessels 16 filled with water are contained in the respective spaces to form a floor body 17, and a solar light receiver 18 for receiving solar light is extended partly of the vessels 16 to conduct floor heating. A gap layer is formed between a front layer ceiling material 21 and an upper layer receiving member 22, the gap layer is partitioned by the partition material 24 to support and partition the layer to form a plurality of spaces, vessels 26 filled with water are contained in the respective spaces to form a ceiling body 27, and a solar light receiver 28 for receiving the solar light is extended partly of the vessels 26 to conduct heating the ceiling.


Inventors:
MAEDA SEIICHI
Application Number:
JP30050695A
Publication Date:
May 06, 1997
Filing Date:
October 26, 1995
Export Citation:
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Assignee:
IZENA KK
International Classes:
E04B1/74; F24D3/00; F24D3/14; F24F3/00; F24F5/00; F24J2/00; F24J2/04; F24J2/34; F24D3/12; (IPC1-7): F24F3/00; E04B1/74; F24D3/00